- 囊封材料
- encapsulated: 包裹的; 包裹性的; 包膠的; 包膠囊的; 包膜; 包圍的; 封裝; 膠囊化的，包入膠囊的; 密封的; 用膠囊包起來的; 有囊包著的
- encapsulated adhesive: 粘囊型膠粘劑
- encapsulated ascites: 包裹性腹水
- encapsulated cabin: 密封艙
- encapsulated cell: 包被細胞
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encapsulated material中文什么意思
- 囊封材料
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例句與用法
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- based on the over research, three different kinds of encapsulating materials of epoxy resin are performed
在各種不同制備方法研究的基礎上，選用不同的改性體系制備出環(huán)氧灌封材料，并對其性能作了評價。 - there are some differences between simulation and experiment results in the patterns " distribution scale for there are still some conditions " differences just as characteristics of encapsulated materials and shapes of encapsulated structure
led結(jié)構(gòu)的參數(shù)變化時，模擬曲線的變化趨勢與實驗情況吻合較好。其中存在的不同和誤差必需根據(jù)led管型的真實參數(shù)適當調(diào)整模擬參數(shù)和條件解決，有待進一步改進。 - in this paper the situation and development of electronic packaging and its requirments for the encapsulate materials in high properties were introduced and a novel kind alicyclic epoxy for electronic packaging was also reviewed with 13 refs
摘要結(jié)合電子封裝的現(xiàn)狀、電子塑封材料的發(fā)展以及電子封裝對塑封材料提出的高性能要求，介紹了新型脂環(huán)族環(huán)氧樹脂及其作為塑封材料的應用前景，其包括耐熱型液體、含磷三官能團型、有機硅多官能團脂環(huán)族環(huán)氧樹脂。 - encapsulating materials of epoxy resin are modified with hgh, nano-sio2 and organophilic montmorillonite, in the present investigation, the microstructue, some properties and influence factors about nano-sio2 and organophilic montmorillonite modified encapsulatig materials have been systematically studied using x-ray diffraction, electron microscopy and differential thermal analysis measurement techniques
隨著航空、電子等事業(yè)的發(fā)展，灌封器件的高性能化對灌封材料提出了越來越高的要求。探索制備環(huán)氧灌封材料的新方法，尋求提高其使用性能的有效途徑是該領域研究的重要課題。 - this paper mainly described the research on rheological property, high thermal stability, flame retardant, the influence of catalyst and insulating heat conduction of organic silicon encapsulating materials, which greatly apply on electronic equipment and large scale integrated circuit and so forth
摘要本文主要綜述了國內(nèi)外用于電子元器件、大規(guī)模集成電路等高科技領域的有機硅灌封材料在流動、耐高溫、阻燃和絕緣導熱等方面的性能以及催化劑對灌封材料的影響的研究應用進展。